ASUS PRIME B760-PLUS Intel B760 LGA 1700 ATX Utilizing 3rd Gen Ryzen processors

Utilizing 3rd Gen Ryzen processors

allowing you to play wirelessly via RF 2

8 mm Depth 66 mm Ear pad dimensions (W x D x H) 66 x 16 x 66 mm Packaging data Package width 72 mm Package type Box Package height 184 mm Package depth 174 mm Package weight 275

Your Workspace

2 accommodates the latest PCI Express 5

ASUS PRIME B760-PLUS Intel B760 LGA 1700 ATX Utilizing 3rd Gen Ryzen processorsPrime B760 PLUS, an Intel B760 LGA 1700 ATX motherboard with PCIe 5. 0, three PCIe 4. 0 M. 2 slots, DDR5, Realtek 2. 5Gb Ethernet, DisplayPort, VGA, HDMI, SATA 6 Gbps, USB 3. 2 Gen 2x2 Type C, front USB 3. 2 Gen 1 Type C, Thunderbolt (USB4) support, Aura SyncKey Features Intel LGA 1700 Socket: Ready for 13th and 12th Gen Intel processors Ultrafast Connectivity: PCIe 5. 0, three PCIe 4. 0 M. 2, Realtek 2. 5Gb Ethernet, USB 3. 2 Gen 2x2 Type C, front