MJ BGA Reballing Solder Stencil Plant Tin Net for HW-1-4 P20/20Pro/Mate10/10 Pro/RS/10/V10/Kirin970/Hi3670 Tin Planting Tool OPTION:HW-4 temperature stability : ±2℃
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Ships within 48 hours · Estimated delivery Aug 9 - Aug 14
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MJ BGA Reballing Solder Stencil Plant Tin Net for HW-1-4 P20/20Pro/Mate10/10 Pro/RS/10/V10/Kirin970/Hi3670 Tin Planting Tool OPTION:HW-4 temperature stability : ±2℃PRODUCT INTRODUCTION Type: Hand Tool Parts Origin: CN(Origin) Model Number: HW Tin Planting Tool is_customized: No Material: Aluminium copper Alloy Usage: Commercial Manufacture Type1: ForP20 20Pro Mate10 10 Pro RS 10 V10 Kirin970 Hi3670 HW 1 Type2: For HW 2 P10 10P MATE9 PRO NOVE2S HW 2 Type3: For MT8 P9 HI CPU HW 3Type4: For HI EMMC EMCP Qualcomm WTR HW 4 Features 1: Stepped groove Design Features 2: High Success Rate of Planting Tin Features 3:
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